DIAMOND WAFERING BLADES
DIAMOND WAFERING BLADES
DIAMOND WAFERING BLADES
- 产品详情
- 产品参数
| DIAMOND WAFERING BLADES FOR PRECISION CUTTERS Arbor ½" [12.7mm], Thickness is listed under Part No. Qty 1/BOX | ||
| 30HC continuous rim diamond wafering blades are recommended for soft gummy materials such as polymers, plastics, rubber. | ||
| Size | Thickness | Part No. |
| 5in [127mm] | 0.020in [0.5mm] | CD-5-30HC |
| 7in [178mm] | 0.025in [0.6mm] | CD-7-30HC |
| 20HC continuous rim diamond wafering blades are recommended for ferrous and non-ferrous. | ||
| Size | Thickness | Part No. |
| 5in [127mm] | 0.020in [0.5mm] | CD-5-20HC |
| 7in [178mm] | 0.025in [0.6mm] | CD-7-20HC |
15HC continuous rim diamond wafering blades are recommended for aggressive general laboratory sectioning of metal matrix composite, Cu, Al, Ti, PCBs, thermal spray coatings. | ||
| Size | Thickness | Part No. |
| 3in [76mm] | 0.006in [0.15mm] | CD-3-15HC |
| 4in [102mm] | 0.012in [0.3mm] | CD-4-15HC |
| 5in [127mm] | 0.015in [0.4mm] | CD-5-15HC |
| 6in [152mm] | 0.020in [0.5mm] | CD-6-15HC |
| 7in [178mm] | 0.025in [0.6mm] | CD-7-15HC |
| 8in [203mm] | 0.035in [0.9mm] | CD-8-15HC |
20LC continuous rim diamond wafering blades are recommended for hard tough materials such as structural ceramics, silicon carbide, boron carbide, silicon nitride, boron nitride. | ||
| Size | Thickness | Part No. |
| 5in [127mm] | 0.015in [0.4mm] | CD-5-20LC |
| 7in [178mm] | 0.025in [0.6mm] | CD-7-20LC |
| 8in [203mm] | 0.035in [0.9mm] | CD-8-20LC |
15LC continuous rim diamond wafering blades are recommended for sectioning very hard or brittle materials including ceramics, sintered carbides, silicon and boron composites, glass, rock, Al2O3 , ZrO2 and concrete. | ||
| Size | Thickness | Part No. |
| 3in [76mm] | 0.006in [0.15mm] | CD-3-15LC |
| 4in [102mm] | 0.012in [0.3mm] | CD-4-15LC |
| 5in [127mm] | 0.015in [0.4mm] | CD-5-15LC |
| 6in [152mm] | 0.020in [0.5mm] | CD-6-15LC |
| 7in [178mm] | 0.025in [0.6mm] | CD-7-15LC |
10LC continuous rim diamond wafering blades are recommended for medium to soft ceramics and glass fiber reinforced composites. | ||
| Size | Thickness | Part No. |
| 3in [76mm] | 0.006in [0.15mm] | CD-3-10LC |
| 5in [127mm] | 0.015in [0.4mm] | CD-5-10LC |
| 7in [178mm] | 0.025in [0.6mm] | CD-7-10LC |
5LC continuous rim diamond wafering blades are recommended for soft and friable ceramics, CaF2, MgF2 and composites with fine reinforcing media. | ||
| Size | Thickness | Part No. |
| 3in [76mm] | 0.006in [0.15mm] | CD-3-5LC |
| 5in [127mm] | 0.015in [0.4mm] | CD-5-5LC |
| DIAMOND WAFERING BLADES FOR ABRASIVE CUTTERS Arbor 1¼" [32mm], Thickness is listed under Part No. Qty 1/BOX | |||
| Application | Bonded | Thickness | Part No. |
| General purpose | Resin | 0.060in [1.5mm] | CD-10-01 |
| Hard materials | Resin | 0.060in [1.5mm] | CD-10-02 |
Ceramics and petrographic samples | Metal | 0.044in [1.1mm] | CD-10-03 |
