COLD MOUNTING SYSTEMS

COLD MOUNTING SYSTEMS

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COLD MOUNTING SYSTEMS

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EpoQuick   
Using: Quick mounting


Cure time: 2 hClarity: ClearViscosity: Very low
Shore D: 80          Peak Temp: 230ºF/110ºCMixing resin to hardener: 5:1
ResinHardener
QtyPart No.QtyPart No.
32oz [950ml]ME-01-0328oz [240ml]MH-01-008
1gal [3.8L]ME-01-12832oz [950ml]MH-01-032




EpoCure
Using: General mounting
Cure time: 6 hClarity: ClearViscosity: Low
Shore D: 80Peak Temp: 104ºF/40ºCMixing resin to hardener: 4:1
ResinHardener
QtyPart No.QtyPart No.
32oz [950ml]ME-02-0328oz [240ml]MH-02-008
1gal [3.8L]ME-02-12832oz [950ml]MH-02-032




EpoFlow
Using: Pore penetration and heat sensitive materials (as PCBs)
Cure time: 9 hClarity: ClearViscosity: Low
Shore D: 78Peak Temp: 104ºF/40ºCMixing resin to hardener: 2:1
Resin
Hardener
Qty Part No.QtyPart No.
32oz [950ml]ME-03-03216oz [470ml]MH-03-016
1gal [3.8L]ME-03-12864oz [1.9L]MH-03-064




EpoLi-ion  


Using: Lithium batteries
Cure time: 24h/25℃ or 2h/60℃Clarity: Wheat/KhakiViscosity: 7000-9000/100-300
Shore D: 85Component: Q1707-1RA/Q5230B
Mixing resin to hardener: 100:30Feature: Resistance to electrolyte corrosion
Resin
Hardener
QtyPart No.QtyPart No.

5kg

ME-04-5

5kg

MH-04-5
10kgME-04-1010kgMH-04-10




AcryQuick   
Using: Fast cure, especially for electronics and PCBs
Cure time: 8-12 minClarity: TranslucentViscosity: Medium
Shore D: 82Peak Temp: 150ºF/65ºCMixing resin to hardener: 2:1
Resin
Hardener
QtyPart No.QtyPart No.
5lbs [2.3kg]MA-01-564oz [1.9L]MA-01-064
Resin and Hardener Kit

QtyPart No.

Resin    1lb [0.45kg]MA-01-K

Hardener    12oz [360ml]

Graduated mixing cups    10

Stirring sticks    10


Brand
USA/QMAXIS
Compounds
Epoxy Systems, Acrylic Systems
Cure time
8-12min, 2h, 6h, 9h, 24h/25℃ or 2h/60℃
Description
QMAXIS cold mounting systems, including epoxy mounting systems and acrylic mounting systems, have low viscosity, low shrinkage, low peak exotherm, and good pore penetration.