| CeriumPrep, CERIUM OXIDE SUSPENSIONS, Colloidal | |||||
CeriumPrep, For fine polishing of materials such as semiconductors, integrated circuits, optical lenses, fiber optic connectors, glass-ceramic substrates and crystal surfaces. |
ULTRAPOLISH Series
PartNo. | Packing [L] | Micron [µm] | pH | Solidscontent [%] | Specificgravity [kg/m³] |
PC-1.15-128 | 3.8 | 1.15 | 9.7 | 15 | 1.14 |
PC-0.95-128 | 3.8 | 0.95 | 8.5 | 10 | 1.05 |
PC-0.45-128 | 3.8 | 0.45 | 8.2 | 45 | 1.64 |
PC-0.075-5000 | 5 | 0.075 | 8.5 | 11.5 | 1.07 |
NANOPOLISH Series
PartNo. | Packing [L] | Micron [µm] | pH | Solidscontent [%] | Features |
PC1-0.95-128 | 3.8 | 0.95 | 8 | 20 | Contains thickenerfor extended suspension time. |
PC2-0.95-128 | 3.8 | 0.95 | 8 | 20 | Suitable for pumpingin automatic dispensing systems. |
PC3-0.95-128 | 3.8 | 0.95 | 8 | 50 | Contains an alternative thickener with higher solidscontent. |